High-Speed IO

The chiplet revolution has emerged as a paradigm shift in the semiconductor industry, enabling modular design and integration of heterogeneous components within a single system. Key drivers of this transformation are the slowdown of Moore’s law, limited reticle limits in extreme ultra-violet lithography, the development of bridge-style packaging, optical links requiring non-CMOS technologies that must be integrated otherwise at package level, and elevated costs of advanced CMOS process which make less convenient to include I/O circuits within the compute or graphic dies.

A major enabler of chiplet technologies are high-density D2D interfaces that ensure seamless communication and data exchange between chiplets. This research aims to develop and experimentally demonstrate energy-efficient and ultra-dense D2D links. Particularly, we will focus on techniques that can tackle the impact of crosstalk in ultra-dense D2D interfaces.